AMD plans to tape out 7nm products by the end of 2017
AMD plans to tape out 7nm products by the end of 2017
When a product tapes out the design process for the integrated circuits, PCB or whatever is being manufactured is finished and a photomask of the circuit/design is created and sent to the fabrication facility. Â
Harlan Sur – JPMorgan
We talked initially in our discussion about the momentum carrying forward for the team and I think one of the things that you guys did a good job at Analyst Day was helping us to understand whatâs next, right? And a good example of that is if we look at Zen 2, which you discussed at Analyst Day, thatâs going to be ready sort of 2018, 2019 timeframe. Just maybe discuss in a little bit more granularity about the potential launch dates. These products are proposed to be using 7-nanometer technology from your foundry partners. When do you think such products are going to be sort of ready for tape-out and when do we see these products sort of out in the market?
Lisa Su
Yes, so our goal is to be very competitive in terms of our long-term roadmap. If you look at the foundry 7-nanometer roadmap compared to some of the other technologies out there, itâs actually really competitive. And I think the gap between sort of the foundry roadmap and like the Intel roadmap has gotten a lot closer. Our goal is to be aggressive with 7-nanometer technology. We will be doing tape-outs later this year. And as we get closer to production, weâll give more insights there. But the idea is to be very competitive throughout the product portfolio.
(Transcript from Seeking Alpha) Â
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The success of Zen 2 and Navi will depend a lot on GlobalFoundries’ performance, both in terms of 7nm’s release timeframe and in terms of the performance characteristics of the node itself. Hopefully, this new process tech will be competitive with Intel’s offerings and will allow AMD to greatly improve the performance and efficiency of their new products.Â
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You can join the discussion on AMD’s 7nm plans on the OC3D Forums.Â
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