OCZ Release FlexXLC DDR3

"OCZ Technology Introduces High-Speed DDR3 within the Flex XLC Series for Ultimate Performance and Optimal Cooling Options. "

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Official Press Release

OCZ Technology Introduces High-Speed DDR3 within the Flex XLC Series for Ultimate Performance and Optimal Cooling Options

With the goal of providing proprietary technology combined with the latest industry platform hardware, OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today launched the OCZ PC3-12800 Flex XLC kit. This high-speed DDR3 solution features the industry’s most unique and powerful cooling capability on the market. Intended for the extreme enthusiast looking for the absolute highest performance, the new Flex XLC delivers unprecedented speed and thermal management to cool the modules for optimal stability and longevity.

The newest PC3-12800 modules feature OCZ’s Flex XLC (Xtreme Liquid Convention) heatsink that delivers superior heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling. This unique “flexible” design gives enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation, allowing the memory to operate at extreme speeds without the high temperatures that inhibit or damage the module’s ICs.

“Increasing clock frequency translates into a linear increase in power consumption and heat dissipation, and with DDR3 hitting doubling the frequency of DDR2, the memory technology is facing serious thermal challenges that require advanced solutions of heat management,” commented Dr. Michael Schuette, VP of Technology at OCZ Technology. “OCZ answers this challenge with the introduction of the Flex Series of heat spreaders to high speed, enhanced latency DDR3 to underscore the commitment to delivering the best overall memory solution with the flexibility to utilize advanced air or water-cooled systems.”

With the ideal balance of sheer DDR3speed and excellent latency, coupled with the award-winning Flex XLC technology, the PC3-12800 modules run at a blazing 1600MHz and feature 6-6-6-18 timings to maximize the performance potential of the latest Intel-based motherboards.

The PC3-12800 Flex XLC modules are optimized for the premier DDR3 platforms and will be available in 2GB (2x1024MB) dual channel kits. As part of OCZ’s line-up of premium memory, the Flex series is backed by a Lifetime Warranty and industry-leading technical support.

For more information on the OCZ PC3-12800 Flex XLC Series, please visit our product page here.

Not up to speed on DDR3 technology? Please enjoy these DDR3 FAQs.

Flex DDR3

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Most Recent Comments

13-08-2007, 07:48:11

Some small details on ATI's next gen GPU


13-08-2007, 09:38:18

Mr. Smith
But... The r600 has plenty of mem bandwidth... That is not the problem... Giving the r700 more bandwidth... Wha...?

13-08-2007, 14:00:43

I'm glad that PCI express 2.0 is backwards-compatible. It bothers me when new bus technologies for expensive things like graphics cards come out and are forced on to us, even if the current products aren't saturating the bus. Then when you buy a new motherboard, you can buy a new one and have to also buy a new card, or buy an old outdated one which isn't much better than your current one. If PCI-E 2.0 was a whole new slot I would be upset, because we'd all have to buy new cards when we upgrade, even those people with brand new 8800 Ultras. On top of that, many current PCI-E cards don't even saturate the x8 bus.

13-08-2007, 18:35:54

On a side note...PCIe 3.0 speeds are looking impressive


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