More detailed information on the HyperX PC3-11000 modules can also be found in the
specifications PDF available on their website. A snippet of this information is shown below:
FEATURES:
• JEDEC standard 1.5V ± 0.075V Power Supply
• VDDQ = 1.5V ± 0.075V
• 533MHz fCK for 1066Mb/sec/pin/
• 8 independent internal bank
• Programmable CAS Latency: 5,6,7,8,9,10
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7(DDR3-1066)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4/ which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C
• Asynchronous Reset
• 1066Mbps CL7 doesn’t have backward compatibility with 800Mbps CL5
• PCB : Height 1.180” (30.00mm), double sided component
PERFORMANCE:
• CL(IDD) - 7 cycles
• Row Cycle Time (tRCmin) - 50.63ns (min.)
• Refresh to Active/Refresh Command Time (tRFCmin) - 90ns
• Row Active Time (tRASmin) - 37.5ns (min.)
• Power TBD W (operating)
• UL Rating - 94 V - 0
• Operating Temperature - 0o C to 85o C
• Storage Temperature -55o C to +100o C
Most of Kingston's previous DDR2 HyperX kits have been based on Micron's notorious D9 IC's, however from the image above we can see that Kingston have made a switch to Elpida for their DDR3 modules. This isn't neccesarily a bad thing as DDR3 is a totally different animal to DDR2, and there's every chance that the Elpida IC's may perform as good or better than their Micron DDR3 counterparts.