AMD Ryzen 5000 Mobile “Cezanne” die render leaks – Zen 3 for laptops

CES 2021 should see AMD reveal their Ryzen 5000 series of mobile processors, bringing its Zen 3 architecture to laptops. Thanks to Videocardz, we have a die shot render of AMD’s Cezanne APU design, which combines Zen 3 CPU cores with Radeon graphics as part of a single, combined unit. 

Like AMD’s Ryzen 4000 Mobile Renoir APU, Cezanne will utilise a monolithic design and not a chiplet-based assembly. Much of AMD’s Ryzen 5000 series APU design is similar to its last-generation counterpart in structure based on the image below.

While the processor appears to feature eight CPU cores and eight graphics cards, Cezanne appears to feature a larger die size. Recent rumours regarding AMD’s Cezanne processor have suggested that the CPU will feature a 16MB L3 cache, a cache which is two times larger than its Zen 2-based Renoir counterpart. Some of this additional size may come from AMD’s restructured Zen 3 CPU cores, which deliver significant increases to both performance and efficiency over AMD’s proceeding Zen 2 designs. 

With their Ryzen 5000 Mobile series of processors, AMD plans to secure further market share gains within the laptop market. The Ryzen 4000 series of mobile processors were a huge success for AMD, and the Ryzen 5000 series should see AMD gain further market share within the mobile PC market. 

Zen 3 will deliver significant IPC increased to AMD’s Ryzen mobile processor designs. In addition to this, the combination of Cezanne’s larger L3 cache and Zen 3’s redesigned cache structure should allow AMD’s Ryzen Mobile processors deliver significant performance improvements in gaming applications. AMD will target gamers with their Ryzen 5000 series of mobile processors. 
 

  
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