AMD’s bringing the 3D packaging revolution to gamers, and it is transformative
AMD’s bringing the 3D packaging revolution to gamers, and it is transformative
AMD’s Lisa Su has announced that AMD has created prototype Ryzen 5000 series processors that feature TSMC’s 3D Fabric technology, utilising the technology initially to add a 3D Vertical Cache to their latest processors. This cache is AMD’s V-Cache, and it stacks an additional 64 MB of SRAM onto AMD’s Ryzen CPU chiplets, effectively increasing their L3 cache from 32MB to 96MB.Â
For AMD’s prototype Ryzen 9 3D Fabric Processors, AMD can offer 192 MB of L3 Cache across two Zen 3 chiplets, delivering enthusiasts an insane amount of cache. These cache stacks are added using Through-Silicon Vias, allowing AMD to deliver 2 TB.s of bandwidth.Â
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With AMD’s 3D Chiplet technology, the company is able to deliver a more interconnect density, greater energy efficiency and lower latencies than the company’s existing chiplet-based multi-die technologies. With 3D chiplets, AMD can create custom chips with faster interconnects and lowered power use, transforming AMD’s capabilities.Â
With their prototype chip with 3D V-Cache, AMD highlighted their gaming performance gains, showcasing incredible increases to performance over their existing Ryzen 5000 series processors, delivering an average performance boost of 15% without changing their underlying Zen 3 core architecture. Â
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In Gears 5, AMD highlighted performance gains of 12% using a prototype Ryzen 9 5900X processor at 4GHz with 3D V-Cache enabled. This is equivalent to a standard generational leap in gaming performance for AMD’s Ryzen offerings, and this is without any changes to AMD’s Zen 3 CPU cores.Â
When combined with AMD’s future Zen CPU architecture, AMD has the potential to deliver larger generational leaps in gaming performance, highlighting the transformative nature of AMD’s V-Cache technology. If AMD can do this today, what will they be able to do tomorrow with this technology?Â
AMD will be launching their Zen 4 architecture next year using TSMC’s 5nm lithography node, and AMD’s CEO, Lisa Su has confirmed that they will be “ready to start production on our highest-end products with 3D chiplets later this year”. AMD has some strong gaming chips on the horizon, whether it be with enhanced Zen 3 processors or all-new Zen 4 CPUs.Â
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AMD’s V-Cache technology is AMD’s first utilization of the latest generation of 3D packaging technology, and you can be sure that AMD has further plans for this technology. As it stands, AMD has a good thing with V-Cache, and it is likely that AMD has a similar cache technology in the works for its future Radeon graphics products.Â
AMD will start producing processors with 3D V-Cache technology later this year, and that means that AMD has some great products in store for 2022.Â
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You can join the discussion on AMD’s revolutionary V-Cache technology on the OC3D Forums.
