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Intel to Bring back FIVR after Skylake and Kaby Lake CPUs

Intel to Bring back Fully integrated Voltage regulator after Skylake and Kaby Lake CPUs

Intel to Bring back Fully integrated Voltage regulator after Skylake and Kaby Lake CPUs.

Intel to Bring back FIVR after Skylake and Kaby Lake CPUs

 

For Intel's Haswell and Broadwell CPUs they did something that was completely new, fully integrate the Voltage regulators of the CPU into the CPU itself, instead of relying on components on the motherboard. This had many advantages which included giving Intel more control of CPU power, allowing them to increase efficiency and simplifying motherboard design, which in turn made motherboards cheaper and easier to produce. 

Intel's Fully Integrated Voltage Regulator (FIVR) was not without it's problems though, as it increased to CPUs temperature, limiting overclockability and reduced the impact that a high end motherboard could have on overclocking, a users were stuck using Intel's power delivery system. 

Intel has decided to remove the FIVR on their upcoming Skylake and Kaby Lake CPUs, which will hopefully mean that Skylake will be much cooler running CPU than Haswell, this will also mean that motherboards are now responsible for power delivery, which means that higher end motherboards with more powerful power delivery systems could help overclockers push Skylake to much higher clock speeds, especially since the hot running FIVR is moved off of the CPU itself.  

  Intel to Bring back Fully integrated Voltage regulator after Skylake and Kaby Lake CPUs.

  

This means that motherboard manufactures will need to put more effort into designing their Z170 series of motherboards, though this means that they can much more easily set themselves apart through design innovations in this department. Before motherboard manufacturers simply needed to rely in Intel's implementation, but this time they can use their own designs, which may be much better for overclocking. 

 

Intel to Bring back Fully integrated Voltage regulator after Skylake and Kaby Lake CPUs.  

HardwareLuxx also states the Intel will be moving to again use FIVR on future CPUs after Skylake and Kaby lake with their future Ice Lake CPUs. 

The appearance of Ice Lake is notable, as before now we were expecting Intel's 10nm Cannonlake CPUs to come after Kaby lake, which could mean that Cannonlake or 10nm is delayed. If what HardwareLuxx says about Ice Lake is true it mean that it will have to use a different CPU socket than Skylake or Kaby lake, as the Intel LGA 1151 will only support CPUs without a FIVR. 

We do not know why Intel may be planning to move back to using FIVR, but it could be for greater CPU efficiency or simply becouse they have rectified the thermal issues which were present with Haswell. 

You can join the discussion on Intel's FIVR and Ice lake CPUs on the OC3D Forums.  

 

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Most Recent Comments

13-07-2015, 11:01:43

Greenback
Might get an updated 2500k Quote

13-07-2015, 11:54:24

NeverBackDown
Gonna be waiting for a couple years then with all these delaysQuote

14-07-2015, 12:32:48

kc5vdj

14-07-2015, 12:37:31

kc5vdj
And if anyone paying attention to Computex didn't figure this out then from the boards with massive numbers of power phases, there is this from Jun 18, purporting to be a delidded i7-6700K with a notable absence of the FIVR array, globbed on TIM, and the same black glue that causes the gap issue, along with a notably smaller die.

I'll bet five USD right now that even more people are going to have to delid, as the basic problem still isn't solved. The glue causes the gap, the gap varies from chip to chip, requiring the thick TIM layer.

They removed it because they still cannot solder.

Could the future reintroduction mean a return to dies large enough to withstand soldering? Maybe massively SMP?

Delidded 6700K: http://www.kitguru.net/components/cp...-ngptim-found/Quote
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