Intel’s HEDT platform to be split into Z399 and X599 sockets
Intel’s HEDT platform to be split into Z399 and X599 sockets
The reasoning behind this rumoured split is obvious, as Intel’s 28-core Computex showcase used the company’s colossal LGA3467 socket. More information about this showcase is available here. Today’s X299 platform used Intel’s smaller LGA 2066 CPU socket, which is significantly smaller than LGA3467 and offers fewer total pins. Intel needs a larger CPU socket to provide an uptick in core count, and moving all future HEDT processors to LGA3467 seems to be too costly for Intel to consider seriously. The only option is for Intel for diversify their HEDT platform. Â
With the release of AMD’s 32-core Threadripper 2nd Generation processors, Intel has to make some major changes to regain the $1500+ CPU market, with PCBuildersClub reporting that Intel’s future LGA 2066 (Z399) motherboards will support CPUs with up to 22 cores, and that future LGA3467 boards (X599) will support up to 28 CPU cores.Â
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The release of AMD’s Threadripper series of processors has shaken the foundations of Intel’s HEDT platforms, with AMD’s Multi-Chip-Module (MCM) designs allowing the company to offer high core count chips that incredibly low prices. The question now is whether or not Intel can deliver high core count processors with both pricing and performance levels that can remain competitive, especially given then single-chip “monolithic” die designs.Â
Intel’s next-generation Z399 and LGA3467 motherboard platforms are expected to release later this year, providing Intel with new high-core count processors to compete with AMD’s Threadripper offerings.Â
You can join the discussion on Intel’s rumoured HEDT roadmap on the OC3D Forums.Â