TEAMGROUP launches Industry-Wide DDR5 modules for high and low temperature environments
These DIMMs are designs for temperatures between -40 and 85 degrees celsius
Published: 3rd August 2021 | Source: TEAMGROUP |
TEAMGROUP Launches Industry-Wide DDR5 modules for high and low-temperature environments
TEAMGROUP, in addition to working on consumer-grade DDR5 modules has revealed that they have created DDR5 DIMMs and SODIMMs that can handle the needs of the industrial market, offering support for wide temperature ranges while maintaining high levels of stability. These wide temperature modules are designed to handle temperatures of between -40 and 85 degrees Celcius and deliver per module capacities of 16GB/32GB, clock speeds of 4800MHz and CAS latencies of 40-40-40.
These industrial-grade DDR5 memory modules will become available in Q3 2021 for customer compatibility testing and enter mass production in Q4 2021.
With stability sitting at the core of the design of these modules, it makes sense for TEAMGROUP to focus solely on stability with these new modules. On the consumer end of the PC market, higher-speed and lower latency DDR5 modules are expected from TEAMGROUP, which is good news for PC gamers.
Press Release - TEAMGROUP Leads Industry with Release of Industrial Wide Temperature DDR5 UDIMM and SODIMM
As a global memory leader with a long-term focus on industrial applications, TEAMGROUP has recognised the tremendous processing needs of the HPC market. To meet the demand for industrial memory can handle sustained high-speed data transmission with low latency, TEAMGROUP has utilised the in-house developed and patent-protected TRUST+ wide temperature technology to provide customers with high stability, durability and wide temperature industrial memory.
Applications for the first DDR5 UDIMM and SODIMM industrial wide temperature memory products include usage in edge computing, Internet of Vehicles, servers, AI, and embedded systems. In response to the stringent demands of efficient computing in the industrial control market, TEAMGROUP has been ready to launch the standard temperature DDR5 IST (TC: 0~85?) memory series and the wide temperature DDR5 IWT (TA: -40~85?) memory series. The latter features exclusive “Graphene-coated Copper heatsink Technology” (U.S. Utility Patent US 11,051,392 B2), which helps maintain a case temperature (TC) of 85~86? under an ambient temperature (TA) of 85?, ensuring low-latency high-speed computing. Without the heatsink, case temperatures (TC) can reach up to 89~90? or more, impairing the high performance of DDR5 and significantly reducing the life span of ICs.
The specifications of our industrial DDR5 memory are 16/32GB per module, 4,800Mhz clock speed, CAS latency of 40-40-40, with 1.1V operating voltage. It comes with on-die ECC function, which provides excellent stability and reliability, and added power management features to utilise power management ICs (PMIC). With better onboard power control to optimise signal integrity and interference resistance, the new DDR5 memory requires only a low operating voltage of 1.1V, making it especially properly for low power consumption industrial automation, medical devices, POS systems, digital signage, thin clients, and other energy-saving or video applications. TEAMGROUP’s DDR5 industrial memory product line will be available for compatibility testing in the third quarter of 2021 at the earliest and is expected to enter mass production in the fourth quarter of 2021.
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