TSMC's 3nm node is reportedly facing delays

Fighting physics is hard work, and it's only getting harder

TSMC's 3nm node is reportedly facing delays

TSMC's 3nm node is reportedly facing delays 

Fighting physics is hard work, and companies like Samsung, TSMC and Intel are battling to make transistors smaller and computers more powerful. The chips inside today's PCs a created using building blocks that are approaching the atomic scale, and pushing to make things smaller and more efficient is becoming increasingly difficult. 

According to a report from Digitimes, TSMC is facing issues with their planned 3nm process, problems which could cause the node to be delayed. Samsung is also reportedly having problems reaching 3nm, forcing both foundries to fall behind schedule. These reported difficulties could make 5nm a longer-lived node than expected, hampering the potential progress of those who rely on leading-edge silicon manufacturing. 

If TMSC and Samsung face 3nm delays, Intel will have more opportunities to catch up to their East Asian competition before a wider gap can emerge. Intel's current 10nm process is roughly equivalent to TSMC's 7nm in terms of transistor scaling, and their smaller 7nm node is reportedly facing delays. 

Creating smaller transistors is becoming an increasingly difficult and expensive process, which is why there are only three silicon foundries which can be considered "leading edge" today.    

TSMC's 3nm node is reportedly facing delays

You can join the discussion on TSMC and Samsung facing potential 3nm delays on the OC3D Forums

«Prev 1 Next»

Most Recent Comments

31-12-2020, 18:44:05

This is likely to affect CPU and GPU releases, both by requiring companies to delay 3nm products and perhaps re-architect things for 5nm, and by overcrowding 5nm. Apple already booked the 3nm process, and if it can't get it then it will have to continue using 5nm, which will leave less capacity for other companies.

I'm also guessing that the problems with getting 3nm equipment could extend to expanding 5nm volume.Quote

Register for the OC3D Newsletter

Subscribing to the OC3D newsletter will keep you up-to-date on the latest technology reviews, competitions and goings-on at Overclock3D. We won't share your email address with ANYONE, and we will only email you with updates on site news, reviews, and competitions and you can unsubscribe easily at any time.

Simply enter your name and email address into the box below and be sure to click on the links in the confirmation emails that will arrive in your e-mail shortly after to complete the registration.

If you run into any problems, just drop us a message on the forums.