JEDEC publishes their UFS 3.0 storage specification

Faster transfer speeds, lower power and suitability for new markets

JEDEC publishes their UFS 3.0 storage specification

JEDEC publishes their UFS 3.0 storage specification

The JEDEC Solid State association has officially released their UFS 3.0 standard, delivering both power and performance improvements to their Universal Flash Storage standard, offering up to 2x the data rate performance, support for lower power NAND and support for a broader range of supported temperatures. 

These changes will not only make UFS faster and more suitable for modern 3D NAND technologies but also allow the standard to be utilised in the automotive space, with the new temperature range of between -40 to 105 degrees Celsius being a useful addition. Transfer speed using this new standard will be around 2.9 GB per second, with UFS utilising dual 11.6 Gbps lanes for data transfer, creating an effective bandwidth of 23.2 Gbps.  

Below is a comment from Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-64 Committee for Embedded Memory Storage and Removable Memory Cards. 

     UFS 3.0, UFSHCI 3.0 and the UFS Card Extension update offer a host of enhancements over the prior versions of these standards that will help product designers enable significant improvements in mobile devices and related applications.

The addition of features specifically for the automotive market underscores the commitment of JEDEC members to continue to evolve the UFS ecosystem to meet the needs of the industry and, ultimately, the consumer.  

JEDEC publishes their UFS 3.0 storage specification

Aspects like lower power consumption and increased performance will undoubtedly be useful for future mobile devices, allowing storage-centric workloads to be accelerated with no negative power consequences. Below is a list of what UFS 3.0 brings to the table. 

UFS version 3.0 defines the following updates over the prior version of the standard:

- Use of MIPI M-PHY v4.1 and the recently released MIPI UniProSM v1.8 specification to form the Interconnect Layer

- Introduction of M-PHY HS-Gear4, with a data rate up to 11.6 Gbps per lane, a 2x performance increase over M-PHY HS-Gear3

- Utilizes Adapt support in MIPI M-PHY v4.1 and QoS support defined in the recently released MIPI UniPro v1.8 specification to support more reliable link communication by monitoring and training the communication channel

- Continues support of 2-Lanes, max data rate of 23.2 Gbps

- 2.5V VCC power supply enables lower power consumption and support for the latest NAND technology

- Temperature event notification, including device alert based on a pre-defined temperature range

- RPMB Regions, supporting multiple RPMB keys with multiple associated RPMB regions. RPMB regions are fixed at manufacturing and are now also configurable at manufacturing.

- Device Error History: Logging mode defined for the device to enable in-system debugging

- Features targeted for the automotive market: Extended temperature range (-40C, 105C) and refresh operation with added host control mechanism to improve device data reliability

You can join the discussion on the UFS 3.0 specification on the OC3D Forums

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