Micron plans stacked GDDR memory, but it’s not for gaming
Micron plans to stack GDDR memory to create higher bandwidth/capacity modules
Micron has reportedly begun developing a new form of GDDR memory, hoping to gain an edge over rivals. With its new stacked GDDR modules, Micron hopes to create a product that sits between HBM and GDDR memory, offering users more bandwidth and capacity per module.
Typically, GDDR memory is used for graphics cards and modern gaming consoles. While it is slower than HBM, it’s easier to integrate and much more affordable. That said, GDDR memory is still used in some AI accelerators. With stacked GDDR memory, the primary downsides of GDDR memory could be mitigated, creating a powerful memory type for the AI market.
According to a report from ET News, prototype samples of this new memory type could be released as early as next year. That said, it remains to be seen if this new memory type will come to fruition.
According to industry sources on the 30th, Micron has begun developing a new product that stacks GDDR vertically. It has been confirmed that the company will install relevant equipment and commence process testing by the second half of this year. An
industry insider familiar with the matter stated, “Initial GDDR stacking of around four layers is expected,” adding, “Prototypes (samples) could be released as early as next year.” As specifications, including the number of layers, are being discussed, it is highly likely that this move is in response to requests from clients, such as AI accelerators.
– ETnews
Stack GDDR memory could be useful for gaming and AI use
Stacked GDDR memory is expected to sit somewhere between HBM and normal GDDR memory. This could make this new memory type useful for AI use and for high-performance gaming products.
Stacked GDDR products are expected to occupy a market segment between HBM and standard (non-stacking) GDDR products. Furthermore, significant demand is projected from high-performance graphics cards for gaming, a sector that continues to grow.
– ETnews
If Micron succeeds, the company will have a new string to its bow. This could place Micron ahead of SK Hynix and Samsung. However, it remains to be seen if this new memory type will prove viable for the memory market. Micron faces many technological hurdles before stacked GDDR memory becomes a real-world product.
While this new memory type could be used in future gaming products, it’s likely to be primarily used for AI inference and similar workloads.
You can join the discussion on Micron’s stacked GDDR memory plans on the OC3D Forums.
