Intel Launches B365 Chipset, Welcome Back 22nm

Intel Launches B365 Chipset, Welcome Back 22nm

Intel Launches B365 Chipset, Welcome Back 22nm

There has been a lot of Intel news lately, making now the perfect time to slip something under the radar, especially as most companies begin their pre-Christmas wind-down.  

Over the past few months, there has been more than a few rumours about new 22nm Intel chipsets, an attempt to move more of their manufacturing onto an older process node so that the company’s valuable 14nm resources can be better utilised to create high revenue processors. 

Intel has officially launched their new B365 chipset (via Intel ARK), a 22nm design which is fairly similar to B360, featuring both upgraded and downgraded aspects. For starters, B365 loses B360’s WiFi capabilities and integrated USB 3.1 controller, though B365 offers more chipset PCIe 3.0 lanes (20 vs 12) and supports hardware RAID for PCIe and SATA devices. 

At this time it is unknown whether or not B365 is new silicon or reused B200 series silicon, with B365 featuring the same package size and what appears to be identical I/O specifications to H270. Our bet is that B365 is reused H270 silicon.

Intel Launches B365 Chipset, Welcome Back 22nm

By creating a new mid-range 300 series chipset on 22nm, Intel has allowed themselves to free up more fab space for 14nm processors, higher value products that will ultimately prove more profitable for the company. 
  
You can join the discussion on Intel’s B365 chipset on the OC3D Forums.