ASUS highlights the “Liquid Metal Technology” that keeps its Gaming Notebooks cool and quiet
ASUS highlights the “Liquid Metal Technology” that keeps its Gaming Notebooks cool and quiet
In the world of OEM systems, manufacturers are limited when it comes to differentiation. There is a reason why the vast majority of laptops utilise the same basic design. The industry discovers what works, and over time things start to homogenise, at least until the next innovative step is found.
Now, ASUS has highlighted one of the major feature upgrades that differentiate them from other notebook manufacturers, and that their use of liquid metal TIM (thermal interface material) on its latest Intel-based notebooks. ASUS has applied this exotic thermal compound to its systems using precision machinery and a patented applications process, which is detailed in the video below.Â
Producers of gaming notebooks have few ways to stand out from the crowd. Component selection is defined by what is available from Intel, Nvidia and AMD and high-resolution/refresh rate screens are often sourced from the same manufacturers. In some ways, there is little that is unique about today’s notebooks, at least at a basic hardware level.
Today, what separates the worst from the best is design, especially when it comes to cooling systems. Every generation at least one manufacturer is shouting about how good their latest notebook fans or heatsinks are, enabling their most recent designs to run cooler, at higher sustained clock speeds or quieter than their competition.
In many ways, cooling is the most exciting differentiator in the notebook market, with ASUS leading the charge into the world of “exotic thermal compound”, delivering load temperatures that are up to 13 degrees cooler on their latest gaming notebooks. To offer these lower thermals, ASUS has utilised Thermal Grizzly’s Liquid Metal TIM, instead of a standard thermal paste.
Instead of just improving the cooling system of Intel’s 10th Generation-based systems, ASUS has increased the conductivity of the interface between their notebook cooler and the system’s processor, allowing heat to be more efficiently transferred to the system, making the user’s CPU cooler, and the entire system quieter.
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  Serious overclockers know that liquid metal offers major cooling benefits for high-end processors. That’s why ROG has patented a factory-application process to harness liquid metal across our full lineup of devices powered by 10th Gen Intel CPUs, lowering temperature for superior sustained performance and less noise. Level up your game today with cooling boosted by liquid metal.
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The problem with Liquid Metal thermal compounds is the risk of spillage, misapplication of leaking over time, as by its very nature liquid metal thermal compounds are conductive. To tackle this problem, ASUS has created precision machinery to apply the right amount of liquid metal to each system and a unique internal frame that prevents liquid metal leakage over time. Thanks to these changes, ASUS is now able to produce systems with liquid metal thermal interfaces without decreasing the reliability of their systems.
This is innovation at work within the OEM notebook market, taking knowledge from the PC enthusiast scene to apply cutting-edge thermal interface technology into their pre-built systems in a way that will improve their thermal performance while posting no risks to their end-users.
You can join the discussion on ASUS bringing Thermal Grizzly Liquid Metal Thermal compounds to their latest ROG notebooks on the OC3D Forums.