New Intel anti-bend ILM could make CPU Contact Frames obsolete

Intel is taking CPU bending seriously with Nova Lake

Intel is reportedly preparing a two-level Independent Loading System (ILM) for its upcoming Nova Lake-S desktop processors. With this solution, Intel aims to put an end to “bendgate” once and for all. With its new ILM, Intel plans to boost CPU cooling performance by increasing the flatness of its integrated heatspreader (IHS). This improves contact with CPU coolers, delivering lower CPU temperatures.

According to Videocardz, Intel’s dual-lever ILM system will be optional for motherboard manufacturers. This higher-end ILM will be available on “enthusiast and overclocking motherboards, targeting users who will desire increased IHS flatness and lower CPU thermals.

Nova Lake-S adds an optional 2-lever independent loading mechanism, called 2L-ILM, for enthusiast and overclocking boards where higher IHS flatness is preferred.

– Paraphrased 2L-ILM annoucement in current Intel roadmap – via Videocardz

(2-lever Intel Mock-Up from Videocardz)

Is Intel bringing an end to CPU contact frames?

With its Alder Lake and Raptor Lake CPUs on LGA-1700, many users have invested in CPU contact frames and other mods to improve thermal performance. With Intel’s new two-level ILM, Intel could make these products obsolete with Nova Lake. That said, it sounds like not all motherboards will use this ILM design.

Based on this leak, it looks like Intel is doing everything it can to win back the enthusiast PC market, but will it be enough to secure Intel a win against AMD with Nova Lake?

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