RAMBUS reveals their planned specifications for HBM3 and DDR5 memory

RAMBUS reveals their planned specifications for HBM3 and DDR5

RAMBUS reveals their planned specifications for HBM3 and DDR5 memory

Memory speeds are becoming increasingly important in modern PCs, with workloads continuing to grow more complex in both the consumer and HPC markets. RAMBUS in a surprise announcement has revealed some of their planned specifications for DDR5 memory and HBM3 memory, with basic overviews of their DDR5 spec already being available to view. 

HBM3 will be a direct replacement of HBM2 and offer a 2x speed increase over HBM2, making HBM3 around 4x more faster than HBM1. DDR5 is also expected to provide a 1.5-2x increase in memory bandwidth over DDR4, giving these two new memory standards significantly more throughput than their predecessors.   

RAMBUS has labelled both HBM3 and DDR5 as 7nm architectures, which means that both standards should not be expected to release before 2019. Even then, 2019 is an optimistic estimate, with 2020 being a more likely release timeframe.  

  

RAMBUS reveals their planned specifications for HBM3 and DDR5

 

With this planned 2x increase in memory bandwidth, HBM3 will offer some insane levels of memory performance for future GPU hardware. This increase in throughput effectively allows a GPU with a single HBM3 chip to deliver similar levels of memory bandwidth as the RX Vega 64 (which uses two HBM2 chips) or R9 Fury X ( which uses four HBM1 chips).

With this announcement, it is clear that both DDR4 and HBM2 still have a lot of life in them, though at least there is now a clear roadmap to replace both standards in time. 

You can join the discussion on RAMBUS’ planned specifications for both HBM3 and DDR5 memory on the OC3D Forums.