Intel Foundry reveals 14A node and plans for stacked X3D-style chips

Intel’s Foundry roadmap paves the way towards a Ryzen X3D competitor

Intel has launched an updated hardware roadmap at their “Intel Foundry Direct 2025” event. While there, Intel’s new CEO, Lip Bu-Tan, unveiled the company’s next-generation 14A (1.4nm) node and a new technology that will allow Intel to rival AMD’s popular Ryzen X3D series gaming CPUs.

On their roadmap, Intel has revealed their 18A-P, and 18A-PT nodes. Their 18A-P node is a high-performance variant of 18A, and 18A-PT supports Through Silicon Vias (TSVs) for 3D chip stacking. Intel’s T-series nodes support Foveros Direct 3D technology, which has similar characteristics to TSMC’s 3D chip stacking technology.

TSMC’s 3D chip stacking tech is already used to create AMD’s Ryzen X3D series CPUs. These processors stack additional L3 cache onto CPUs to deliver enhanced performance. With 18A-PT, Intel will have the ability to create its own x3D-style CPUs. This could transform the gaming CPU market, as AMD will no longer be the only company with 3D stacked caches.

(Intel Foundry Roadmap – Via Andreas Shilling)

Intel’s Foundry Roadmap makes it clear that Intel Foundry is continuing to push forward. Unlike TSMC, Intel’s 14A-class node uses High-NA EUV technology. If that differentiation gives Intel superior density and/or performance characteristics, Intel Foundry has the potential to gain a lot of orders. Clearly, Intel is trying to step ahead of TSMC.

Note that Intel’s 18A-PT node isn’t due to be ready anytime soon. That means Intel fans shouldn’t expect a Ryzen X3D competitor anytime soon. Intel will need to compete with AMD’s gaming champion in some other way.

You can join the discussion on Intel’s new Foundry Roadmap on the OC3D Forums.