TSMC boasts HUGE gains with its planned A14 node

TSMC aims to extend its process tech lead with 14A in 2028

TSMC has officially confirmed that the development of its next-generation A14 node is ahead of schedule. The node is due to enter production in 2028, succeeding the company’s N2 logic process.

N2 is entering volume production this year, and 14A will deliver stronger performance in several key metrics. The new node will use its new NanoFlex Pro cell architecture to deliver greater power efficiency, performance, and design flexibility.

Performance-wise, A14’s said to deliver a 15% improvement over N2 at the same power levels. Alternatively, it can deliver a 30% power reduction while producing the same speeds. Furthermore, the node promises a 20% increase in logic density over N2.

Compared with the N2 process, which is about to enter volume production later this year, A14 will offer up to 15% speed improvement at the same power, or up to 30% power reduction at the same speed, along with more than 20% increase in logic density. Leveraging the Company’s experience in design-technology co-optimization for nanosheet transistor, TSMC is also evolving its TSMC NanoFlex™ standard cell architecture to NanoFlex™ Pro, enabling greater performance, power efficiency and design flexibility.

– TSMC

No currently available products use TSMC’s N2 lithography node. Current-generation CPUs and GPUs from AMD and Nvidia use TSMC’s N4 node. However, AMD has confirmed that its upcoming Zen 6 CPU CCDs have taped out using TSMC’s N2 lithography node.

With A14, TSMC is effectively promising two generational leaps above the silicon used on today’s cutting-edge PC components. A14 places TSMC in a strong position moving forward, cementing its position as a leading silicon foundry.

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