Cooler Master to unveil actively cooled MasterDIMM AC DDR5 DRAM modules at Computex 2026

Cooler Master and G.Skill team up to create cooler, faster-running DDR5 memory modules

Cooler Master has partnered with G.Skill to create its first actively cooled MasterDIMM AC DDR5 DRAM modules. These modules feature fan-assisted cooling solutions that aim to deliver enhanced cooling and performance in workstations, gaming systems, and AI infrastructure.

These new memory modules support ultra-high capacities of up to 64GBx2, and are designed to remain stable during intensive workloads. With active cooling, Cooler Master aims to ensure sustained performance, high signal integrity under load, and more reliable memory operation.

At Computex, Cooler Master will be showing modules with AMD EXPO profiles up to DDR5-6000 CL26 and extreme-frequency Intel XMP 3.0 CU-DIMM modules with DDR5-8400 speeds.

By working with G.Skill, Cooler Master can leverage their memory expertise and their own cooling prowess to create a stronger overall product. Cooler Master claims that their coolers can deliver up to a 15ºC thermal improvement under load.

Will Cooler Master MasterDIMM AC modules be loud?

Cooler Master claims that these extreme-performance memory modules will not impact system acoustics. These coolers are designed to deliver high-frequency DDR5 memory operation while retaining a quieter, more refined PC experience. In other words, the fans on these DRAM coolers will not be spinning fast enough to be loud. Cooler Master targets an under 35dB volume.

The one major downside of these DDR5 modules is their thickness. Each module will take up two DRAM modules’ worth of space. That means that users will not be able to use all four DRAM slots on most motherboards. While most DDR5 users will only use two modules, these large active coolers will make DRAM upgrades more difficult.

You can join the discussion on Cooler Master’s MasterDIMM AC DDR5 memory modules on the OC3D Forums.