The new king of Air coolers? Cooler Master reveals their V8 3DVC with 3D Vapour Chamber tech
Cooler Master promises unparalleled cooling efficiency with their new V8 3DVC heatsink
Cooler Master have called their V8 3DVC “the pinnacle of cooling technology”. This heatsink utilises superconductor composite heatpipe technology, boosting heat transfer efficiency, and a 3D vapour chamber for even heat distribution. Cooler Master claims that this cooler can handle thermal loads of 300 watts, and the heatsink itself is cooled using two 120mm Mobius fans.
Unlike other high-end air coolers, this new heatsink from Cooler Master doesn’t utilise a dual-tower design. It is a single tower heatsink design that utilises innovative technologies to deliver high-end cooling performance. This does make us wonder if Cooler Master could create an even bigger version of this cooler? Perhaps a V10 3DVC cooler with a dual-tower design and two 140mm fans?
- Optimized for High-Performance CPUs: Capable of handling thermal loads up to 300W.
- Redesigned Vapor Chamber: For even heat distribution.
- Superconductive Composite Heat Pipe Technology: Nearly doubles the Q-max for maximum heat transfer efficiency.
- Stylish and Functional Design: Aesthetically pleasing and complements any setup.
- Efficient Heat Transfer and Cooling: Keeps your CPU at optimal temperatures, even under heavy loads.
Sadly, Cooler Master has not revealed the release date or pricing of this new heatsink yet. That said, we expect to hear more about the V8 3DVC at CES.
You can join the discussion on Cooler Master’s new V8 3DVC CPU air cooler on the OC3D Forums.