AMD confirms that their Ryzen 3rd Generation processors will be soldered

AMD confirms that their Ryzen 3rd Generation processors will be soldered

AMD confirms that their Ryzen 3rd Generation processors will be soldered

When AMD announced their Ryzen 3rd Generation processors at Computex 2019, one major detail was missing from their specifications. What kind of Thermal Interface Material (TIM) will be used to keep AMD’s upcoming processors cool? 

In the CPU market, there are two popular choices in thermal interface materials, solder or polymer-based thermal compounds. Typically, solder is considered the superior solution for microprocessors, offering a higher level of thermal conductivity while polymer-based solutions are cheaper to create/apply and are less likely to result in processor damage during manufacturing. 

AMD’s technical marketing director, Robert Hallock, has confirmed on Twitter that the company’s Ryzen 3rd Generation “Matisse” processors will be soldered, a factor which will help PC gamers to keep their CPUs cool under heavy loads. The multi-die nature of Ryzen 3rd Generation makes the soldering process more difficult than usual, but AMD has committed to providing the best thermal solution for their customers. 

Some older processors, such as Intel’s “Clarkdale” series of chips, use a two-chip design, where Intel soldered the die of the processor while the I/O die used a thermal paste. AMD’s Ryzen 3rd Generation processors are all likely to be soldered, as Hallock’s statement didn’t hint that AMD was using both thermal interface solutions. 

  

AMD confirms that their Ryzen 3rd Generation processors will be soldered  

AMD’s decision to use a soldered thermal interface is great news for PC builders, as it will enable AMD users to keep their systems cooler and quieter while enabling additional overclocking headroom for high-end users. 

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