SK Hynix unveils “iHBM” to reduce memory thermals with “ICE” tech
SK Hynix unveils “iHBM” technology to reduce memory thermals and boost AI performance
SK Hynix has officially launched its iHBM technology, which adds Integrated Cooling Elements (ICEs) into high-bandwidth memory (HBM), to boost memory cooling and deliver higher memory speeds.
With ICEs, SK Hynix uses a silicon-based material to dissipate heat from an HBM package by providing an additional thermal pathway. ICEs are placed on the Die-to-Die Physical Layer (D2D PHY) of HBM chips in locations where heat is most concentrated. This “heat dissipation path” allows heat to leave HBM chips more quickly, resulting in lower memory temperatures. The thermal resistance of HBM chips can be reduced by 30% using this technology.
This tech is designed to deliver more stable HBM thermals and enable further HBM advancement. This could enable increased die stacking for future HBM versions, and higher overall memory speeds.
With the iHBM solution, the company has taken a structural approach to addressing the heat management issue. Existing HBM products rely on an indirect cooling method that draws heat away through the core die. In contrast, the iHBM solution places ICEs directly in the D2D PHY area where heat concentration is the highest, creating an additional ‘heat dissipation path’. This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.
– SK Hynix
SK Hynix says that its iHBM technology is based on its “market-proven Mass Reflow Moulded Underfil (MR-MUF) technology”. This means that SK Hynix already has the ability to mass-produce this new type of HBM memory.
SK Hynix has also noted that this solution offers high design compatibility with existing System-in-Package(SiP) architectures. This allows customers to adopt this new thermal technology with minimal design adjustments.
Through the iHBM solution, slated for deployment in next-generation HBM products including HBM5, SK hynix aims to increase the stability and operational efficiency of HPCs, AI data centers by meeting heat management standards required in high-density and high-bandwidth environments.
– SK Hynix
iHMB technology is coming to next-generation HBM products from SK Hynix. Note that this includes HBM5 memory. If adopted, this tech will make HBM-equipped AI accelerators easier to cool. Furthermore, it could deliver increased performance through higher memory speeds by reducing thermal overheads.
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