Next-gen liquid cooling! Asetek reveals AI Optimised Cold Plate designs using Fabric8Labs tech

Asetek are using AI and 3D printing to develop the next generation of liquid cooling solutions

At the ASUS ROG booth at Computex 2024, Asetek are showcasing the technology behind the next generation of liquid cooling solutions. Using Fabric8Labs’ metal 3D printing tech, Asetek are working on AI optimised cold plate designs that promise to revolutionise the liquid cooling market.

Asetek and Fabric8Labs have been working together to create parts using Electrochemical Additive Manufacturing (ECAM) technology. This enables the creation of intricate, high resolution structures that offer Asetek excellent thermal properties. In essence, this tech enables the creation of parts that cannot be built using traditional machining techniques. As a result, this tech allows Asetek to uncover new ways to boost the cooling performance of their products.

Using this new manufacturing technology, Asetek has utilised AI to help enhance their new cold plate designs. This allows Asetek to push for lower thermals with their liquid cooling products, boosting their cooling performance and efficiency.

This new technology allows Asetek to create cold plates that are better optimised for fluid dynamics and use structures that have never been used in a cold plate before.

Asetek are building AI Optimised cold plates, not artificially intelligent ones

Don’t worry, Asetek’s new cold plates won’t turn into skynet. Asetek have simple utilised AI simulation tools to help create their new cold plate architecture. This allows Asetek to use more complex geometries to deliver the best performance possible. Basically, these complex structures can only be created using high resolution metal 3D printing. To put it another way, these cold plates cannot be built using traditional tools.

What Asetek has promised to deliver is game-changing for overclockers and PC enthusiasts. AI optimised 3D printed cold plate designs have the potential to make liquid cooling solutions more performant and more reliable.

With less thermal resistance, Asetek’s future cold plate designs will enable lower operating temperatures for future PCs. That’s great news for overclockers, as that thermal headroom will allow them to push their hardware to new heights. Additionally, this tech will result in quieter systems. After all, quieter pumps and fans will deliver more effective cooling to high performance liquid cooled systems.

The future seems bright for PC liquid cooling solutions. Even so, it is unclear when this new tech will make it to market.

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