Next-Gen AMD Radeon UDNA GPUs to use TSMC N3E silicon and have a proper flagship-level product

Next-gen AMD CPU and GPU plans leak

On Chiphell, via @9550pro, details for AMD’s next-generation CPU and GPU products have leaked. This has revealed AMD’s planned use of TSMC N3E silicon with their next-gen Radeon UDNA GPUs and Zen 6 CPUs.

Based on zhangzhonghao’s leak, AMD plans to release flagship-level GPU products with its UDNA architecture. This will mark a return to form for AMD, as its upcoming RDNA 4 lineup will not feature ultra-high-end product offerings.

CPU-wise, AMD reportedly plans to use TSMC’s N3E process node to create its Zen 6 CPU CCDs. TSMC’s N4C node will reportedly be used for AMD’s next-generation IO dies. This means that AMD’s next-generation CPUs will benefit from architectural changes and a major shift in lithography nodes. That means that we should expect a larger generational performance leap than what we saw moving from Zen 4 to Zen 5.

AMD is also reportedly working on a successor to its “Strix Halo” product, aiming to use AMD’s “3D” technology to improve both CPU and GPU performance. This likely means that this product will utilise AMD’s X3D 3D Cache technology to boost CPU/GPU cache sizes and bandwidth.

AMD has already confirmed they are working on a new GPU architecture called UDNA. This GPU architecture will bring together AMD’s Gaming-focused RDNA and data-center-focused CDNA product ranges. This will give AMD and developers a unified GPU architecture to develop/target.

You can join the discussion on AMD’s UDNA GPU plans on the OC3D Forums.

Mark Campbell

Mark Campbell

A Northern Irish father, husband, and techie that works to turn tea and coffee into articles when he isn’t painting his extensive minis collection or using things to make other things.

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