AMD’s rumoured to tap TSMC and Samsung when they move to 5nm

AMD’s Zen 2 architecture takes the company’s processors in a brave new direction, transitioning further away from the monolithic approach of older CPU designs and fully into the era of multi-chip processing.   

This move has also seen AMD utilise silicon from multiple manufacturers within a single product, with both AMD’s EPYC 2nd Generation processors and Ryzen 3rd Generation processors employing TSMC 7nm CPU cores and an I/O die that is manufactured using Globalfoundries’ 14nm node. This step opens up many options for AMD moving forward, offering a level of versatility that wasn’t possible with the company’s older products. 

Sources over at Semi Wiki have claimed that AMD plans to split their manufacturing between Samsung and TSMC when they move to 5nm, with both manufacturers being expected to reach volume production within a similar timeframe. TSMC was the earliest to 7nm, forcing AMD to go all-in on TSMC’s node, but Samsung will be better prepared to take on TSMC with 5nm, assuming everything goes to plan. 

With regards to future process nodes, AMD plans to keep their options open, taking full advantage of the competition within the semiconductor industry to select the best nodes for their products and secure fair pricing. At this time it is expected that AMD will split product lines between each manufacturer, depending on the specific needs of their future products. 

  

Next-generation 5nm lithography nodes from TSMC and Samsung are expected to enter volume production within a similar timeframe and deliver similar performance characteristics, giving AMD the opportunity to take advantage the competition between Samsung and TSMC in the leading edge foundry space.

TSMC plans to tape out their first 5nm design in the first half of this year and enter volume production in the first half of 2020.  

You can join the discussion on AMD’s plans to tap both TSMC and Samsung for 5nm on the OC3D Forums.