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Published: December 31, 2016 | Source: guru | Author: Mark Campbell

TSMC says 10nm FinFET is on track despite rumours of delays

TSMC says 10nm FinFET is on track despite rumours of delays

TSMC says 10nm FinFET is on track despite rumours of delays

 
 
TSMC has stated that their 10nm FinFET process is “totally on track” despite rumours of delays, countering recent reports from Digitimes which stated that both TSMC and Samsung are experiencing low yields with their respective 10nm manufacturing nodes. 
 
According to TSMC’s senior director of corporate communications, Elizabeth Sun, their 10nm process will be contributing to their sales revenue in Q1 2017, though that this new process will account for less than one percent of their revenue during that time.  
 
In Q3 2017 TSMC plans to tape out silicon for five mobile products, with the company predicting that the creators of chips for the high-end smartphone market will move from 16nm to 10nm during 2017.  

  

TSMC says 10nm FinFET is on track despite rumours of delays  

These days the names of new manufacturing processes are effectively marketing, with TSMC stating that they can make three-dimensional geometry tweaks to create processes that are an “effective” 1nm. 

TSMC say that they are planning to build a new fab that will be capable of creating 3nm SoCs as early as 2022, though at this time it is unknown how TSMC plans on achieving this goal. 

Right now, TSMC plans to ramp up their 10nm production in 2017 as well as create their first 7nm products, though at this time the performance characteristics of these new processing nodes are unknown. 

 

You can join the discussion on TSMC’s 10nm process node on the OC3D Forums. 

 

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