Published: February 22, 2017 |
Source:
Toshiba |
Author:
Mark Campbell
Toshiba are now shipping samples of their 64-layer, 512Gb 3D NAND
Toshiba are now shipping samples of their 64-layer, 512Gb 3D NAND
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Toshiba has announced that they are now shipping samples of their 64-layer, 512Gb 3D TLC NAND, offering up to 64GB of storage capacity per die.
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This new storage type offers a huge improvement over the companies older 48-layer 256Gb BiCS NAND. Toshiba now plans on creating a new 16-die product in a single package, allowing Toshiba to have 1TB of storage in a single NAND package with their new 64-layer 3D NAND. Â
With 3D NAND it will soon be possible to create SSDs with much larger capacities, especially in smaller form factors like M.2. Right now Samsung is dominant in the SSD market through their use of high-speed, high-capacity V-NAND, which makes them one of the only companies that can provide  2TB M.2 SSD at the time of writing.Â
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Hopefully, Toshiba and other NAND producers can ship high-capacity 3D NAND in meaningful quantities within the next few months, as the NAND market desperately needs an increase in supply to lower prices. In recent months NAND chips have seen a heavy price increase due to heavy damand. Â
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Toshiba has recently confirmed that they plan on spinning off their NAND production division into a separate company, creating a dedicated NAND producer that will allow Toshiba to refinance itself through external investment. Originally Toshiba announced that they planned on selling a 20% stake in the company, though it now looks like the company will be selling a majority stake of around 60% in order to pay their existing debts.Â
Originally Toshiba announced that they planned on selling a 20% stake in the company, though it now looks like the company will be selling a majority stake of around 60% in order to pay their existing debts.Â
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You can join the discussion on Toshiba shipping early samples of their 64-layer 512Gb 3D NAND on the OC3D Forums. Â Â
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