AMD aims to use Glass Substrates in between 2025 and 2026 – Report claims

AMD reportedly accelerates is Glass Substrate efforts to remains ahead of their competitors

The world of high-end chip design is changing. Manufacturers can no longer rely on major leaps in lithography technology to help them pack more transistors into their chips. Now, chipmakers must now explore new ways to enhance and expand their future designs. For AMD, one of those advancements is their use of Glass Substrates.

AMD reportedly plans to start using Glass Substrates in 2025 or 2026. Glass substrates offer users many benefits over traditional organic substrates. Primarily, their increased flatness, stiffness, and mechanical strength make them ideal for larger chip designs. Additionally,  they can offer stronger signalling characteristics. In all, these benefits make glass substrates ideal for large multi-chip processor designs.

As AMD aims to make larger and more complex chips, Glass Substrates will allow the company to use denser interconnects and superior mechanical properties. If used correctly, they may even make AMD’s manufacturing costs lower, as chiplets may become usable without an expensive silicon interposer.

AMD is also accelerating its efforts, planning to introduce glass substrates between 2025 and 2026 and collaborating with global component companies to stay ahead in the race. – Business Korea

(Intel also has plans for Glass Core Substrates)

Glass substrate technology is an obvious innovation that AMD should explore. Intel already has plans to utilise glass core substrates, and so do other major tech companies. As larger chiplet-based processors become more common, glass substrates may become the norm. That said, traditional organic substrates will still have their place for smaller chip designs with few chiplets.

You can join the discussion on AMD’s plans to use Glass Substrates in 2025/2026 on the OC3D Forums.